Taiwan Semiconductor Company, MediaTek has just announced its newest 5G chipset, named Dimensity 9000. This is also the first chipset made by TSMC that comes with 4nm fabrication.
With the use of this 4nm fabrication, the Dimensity 9000 can also provide an increase in performance but still maintain better power efficiency to avoid wasteful battery consumption.
Dimensity 9000 Features and Specs
This SoC (System-on-Chip) also comes with a 1+3+4 composition where there is 1 Cortex-X2 core with a speed of 3.05GHz, then 3 Cortex-A710 cores with a speed of 2.85GHz, and also 4 Cortex A512 cores with a speed of 1. 8GHz.
This chipset also supports the use of LPDDR5x RAM with speeds of up to 7500Mbps. In addition, there is also a 14MB cache which MediaTek says can increase performance by 7% and bandwidth consumption reaches 25% compared to the 8MB cache they used before.
Meanwhile, in terms of GPU, Dimensity 9000 uses Mali-G710 with 10-cores that supports the Ray-Tracing SDK so that application developers can use this support to provide PC-like visual improvements.
The Dimensity 9000 also has an ISP (Image Signal Processor) which is capable of recording 4K HDR video from three cameras at once. Then there is also the APU (AI Processing Unit) which is claimed to have 16% better performance than the APU on Google Tensor.
Other features supported on this chipset are Bluetooth 5.3, WiFi 6E 2×2, and Beidou III-B1C GNSS standard.
The plan is that the first flagship smartphone that will use the Dimensity 9000 chipset will be released at the end of the first quarter of 2022.
Kindly share with us your thought on this new chipset and which smartphone do you think would be the first to sport the Dimensity 9000 SoC? Let us know through the comment box below.
