Samsung Unveils Flagship Exynos 9825; First 7nm EUV Chip

Samsung announces the industry's first 7nm EUV chipset, Exynos 9825 ahead of the Galaxy Unpacked Event. Find out more here.

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Exynos 9825

Barely hours to the Samsung’s biggest show of the year, the New York Unpacked Event, the South Korean giant has taken the wraps off its latest flagship mobile processor – Exynos 9825 SoC. It happens to be the first 7nm chip under the Exynos family, as well as the first 7nm EUV process chipset.

Well, we’ve seen a couple of 7nm chipsets in time past from Qualcomm, Apple and Chinese powerhouse, Huawei. It might seem Samsung is late to the party which is actually true. But like the saying goes, he who laughs last laughs best, that’s the scenario Samsung shows off with this 7nm EUV chipset. For the records, no other mobile processor uses the EUV process.

The acronym EUV represents “Extreme Ultraviolet lithography” and Samsung describes the technology as the ability to utilize “extreme ultraviolet wavelengths to print finer circuits and develop a more power-efficient processor”. As such, it offers improved performance and more efficiency.

Also, the Exynos 9825 is the successor to the Exynos 9820 SoC, Samsung’s flagship chip with 8nm LPP process. Similar to the predecessor, the chip is equipped with an octa-core CPU consisting of two M4 customised processors of 2.73GHz, two Cortex-A75 clocked at 2.31GHz and four Cortex-A55 capped at 1.95GHz.

For graphics, the Mali G76 MP12 GPU is attached to the Exynos 9825 chip. In addition, there’s support for LPDDR4X RAM, UFS 3.0 & UFS 2.1 internal storage. That’s good for faster loading of storage data and more. The Shannon 5000 Cat modem provides 4G LTE connectivity while there’s pairing compatibility with the Exynos 5100 for 5G.

Exynos 9825

Interesting enough, videos of 8K resolution @ 30fps and 4K UHD resolution @ 150fps frame rates are supported by the chip. It also gives room for camera sensors of dual 16MP + 16MP, frontal 22MP and rear 22MP. Meanwhile, AI-assisted photography can be engineered by the NPU on board.

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