MediaTek announced System-on-Chip (SoC) 5G, Dimensity 1000, with innovations in connectivity, multimedia, AI, and imaging for premium smartphones and flagship.
“Our Dimensity series is the end of MediaTek’s investment in 5G and positions us as leaders who drive the development and innovation of 5G. Our 5G technology is racing with anyone in the industry,” Joe Chen, President of MediaTek, said in a written statement.
“We chose dimension as a name to show how our 5G solutions are driving new waves of innovation and experience, such as the fifth dimension in fairy tales,” he continued.
MediaTek Dimensity 1000 5G Chipset Features
Dimensity 1000 is the first 5G MediaTek mobile SoC in the 5G chipset family, with a combined 5G single-chip solution and an integrated 5G modem inside a 7nm chip.
This SoC supports two 5G carrier aggregations (2CC CA) and offers the fastest throughput in the world with 4.7Gbps downlink and 2.5Gbps uplink on sub-6GHz networks.
Dimensity 1000 is designed to support stand-alone and non-stand-alone (SA / NSA) sub-6GHz networks, and has multi-mode support for all generations of cellular connectivity ranging from 2G to 5G.
This chipset also integrates the latest WiFi 6 and Bluetooth 5.1+ standards for the fastest and most efficient local wireless connectivity, offering more than 1Gbps throughput for downlinks and uplinks.
Dimensity 1000 combines four Arm Cortex-A77 cores that operate up to 2.6 GHz with four power-efficient Arm Cortex-A55 cores that operate up to 2GHz.
This design is said to produce an optimal balance between high performance and power savings.
MediaTek also complements Dimensity 1000 with the latest AI Processing Unit (APU) from MediaTek – APU 3.0 – with more than twice the performance of the previous generation APU. This APU produces a significant performance boost of 4.5 TOPS.
The first devices to use SoC Dimensity as a chipset will start to be available on the market starting in the first quarter of 2020.